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Showing posts with label Non-volatile memory. Show all posts
Showing posts with label Non-volatile memory. Show all posts

Thursday, June 30, 2011

IBM scientists demonstrate computer memory breakthrough


For the first time, scientists at IBM Research have demonstrated that a relatively new memory technology, known as phase-change memory (PCM), can reliably store multiple data bits per cell over extended periods of time. This significant improvement advances the development of low-cost, faster and more durable memory applications for consumer devices, including mobile phones and cloud storage, as well as high-performance applications, such as enterprise data storage.

With a combination of speed, endurance, non-volatility and density, PCM can enable a paradigm shift for enterprise IT and storage systems within the next five years. Scientists have long been searching for a universal, non-volatile memory technology with far superior performance than flash – today’s most ubiquitous non-volatile memory technology. The benefits of such a memory technology would allow computers and servers to boot instantaneously and significantly enhance the overall performance of IT systems. A promising contender is PCM that can write and retrieve data 100 times faster than flash, enable high storage capacities and not lose data when the power is turned off. Unlike flash, PCM is also very durable and can endure at least 10 million write cycles, compared to current enterprise-class flash at 30,000 cycles or consumer-class flash at 3,000 cycles. While 3,000 cycles will out live many consumer devices, 30,000 cycles are orders of magnitude too low to be suitable for enterprise applications (see chart for comparisons).

“As organizations and consumers increasingly embrace cloud-computing models and services, whereby most of the data is stored and processed in the cloud, ever more powerful and efficient, yet affordable storage technologies are needed,” states Dr. Haris Pozidis, Manager of Memory and Probe Technologies at IBM Research – Zurich. “By demonstrating a multi-bit phase-change memory technology which achieves for the first time reliability levels akin to those required for enterprise applications, we made a big step towards enabling practical memory devices based on multi-bit PCM.”

Multi-level Phase Change Memory Breakthrough

To achieve this breakthrough demonstration, IBM scientists in Zurich used advanced modulation coding techniques to mitigate the problem of short-term drift in multi-bit PCM, which causes the stored resistance levels to shift over time, which in turn creates read errors. Up to now, reliable retention of data has only been shown for single bit-per-cell PCM, whereas no such results on multi-bit PCM have been reported.

PCM leverages the resistance change that occurs in the material — an alloy of various elements — when it changes its phase from crystalline — featuring low resistance — to amorphous — featuring high resistance — to store data bits. In a PCM cell, where a phase-change material is deposited between a top and a bottom electrode, phase change can controllably be induced by applying voltage or current pulses of different strengths. These heat up the material and when distinct temperature thresholds are reached cause the material to change from crystalline to amorphous or vice versa.

In addition, depending on the voltage, more or less material between the electrodes will undergo a phase change, which directly affects the cell's resistance. Scientists exploit that aspect to store not only one bit, but multiple bits per cell. In the present work, IBM scientists used four distinct resistance levels to store the bit combinations “00”, “01” 10” and “11”.



To achieve the demonstrated reliability, crucial technical advancements in the “read” and “write” process were necessary. The scientists implemented an iterative “write” process to overcome deviations in the resistance due to inherent variability in the memory cells and the phase-change materials: “We apply a voltage pulse based on the deviation from the desired level and then measure the resistance. If the desired level of resistance is not achieved, we apply another voltage pulse and measure again — until we achieve the exact level,” explains Pozidis.

Despite using the iterative process, the scientists achieved a worst-case write latency of about 10 microseconds, which represents a 100× performance increase over even the most advanced Flash memory on the market today.

For demonstrating reliable read-out of data bits, the scientists needed to tackle the problem of resistance drift. Because of structural relaxation of the atoms in the amorphous state, the resistance increases over time after the phase change, eventually causing errors in the read-out. To overcome that issue, the IBM scientists applied an advanced modulation coding technique that is inherently drift-tolerant. The modulation coding technique is based on the fact that, on average, the relative order of programmed cells with different resistance levels does not change due to drift.

Using that technique, the IBM scientists were able to mitigate drift and demonstrate long- term retention of bits stored in a subarray of 200,000 cells of their PCM test chip, fabricated in 90-nanometer CMOS technology. The PCM test chip was designed and fabricated by scientists and engineers located in Burlington, Vermont; Yorktown Heights, New York and in Zurich. This retention experiment has been under way for more than five months, indicating that multi-bit PCM can achieve a level of reliability that is suitable for practical applications.

The PCM research project at IBM Research – Zurich will continue to be studied at the recently opened Binnig and Rohrer Nanotechnology Center. The center, which is jointly operated by IBM and ETH Zurich as part of a strategic partnership in nanosciences, offers a cutting-edge infrastructure, including a large cleanroom for micro- and nanofabrication as well as six “noise-free” labs, especially shielded laboratories for highly sensitive experiments.

A History of Pioneering Memory Technology

In 1966, IBM Fellow, Dr. Robert Dennard invented dynamic random access memory — DRAM — which, when combined with the first low-cost microprocessors, opened the door to small personal computers. Today, every PC, notebook computer, game console and other computing device is loaded with DRAM chips. DRAM also powers mainframes, data center servers and most of the machines that run the Internet. In 1988, Dennard was awarded the US National Medal of Technology for the invention of DRAM. As IBM celebrates its Centennial this year, the company celebrates DRAM as one of its 100 greatest innovations.

More information: The paper “Drift-tolerant Multilevel Phase-Change Memory” by N. Papandreou, H. Pozidis, T. Mittelholzer, G.F. Close, M. Breitwisch, C. Lam and E. Eleftheriou, was recently presented by Haris Pozidis at the 3rd IEEE International Memory Workshop in Monterey, CA.

Provided by IBM

Monday, June 13, 2011

World's first Content Addressable Memory stores data without using power



NEC Corporation and Tohoku University announced today the development of the world's first content addressable memory (CAM) that both maintains the same high operation speed and non-volatile operation as existing circuits when processing and storing data on a circuit while power is off.

NEC's new CAM is a part of spintronics logic integrated circuit technologies that utilize the negative properties of electrons together with the spin magnetic moment. The new CAM utilizes the vertical magnetization of vertical domain wall elements in reaction to magnetic substances in order to enable data that is processing within the CAM to be stored on a circuit without using power. This contrasts to conventional technologies that required data to be stored within memory. As a result, data can be saved on circuits even when power is cut from the CAM.

In recent years, the use of ICT equipment has steadily increased due to the widespread growth of cloud computing. Most existing equipment requires a short amount of time to get started and internal circuits remain active when the equipment is in standby mode. Therefore, the growing consumption of power by ICT equipment in standby mode has become a serious concern.

Use of the new CAM in combination with existing nonvolatile memory is related to greater non-volatility of CPU for electronics and other storage devices. Furthermore, use of this new CAM enables the development of electronics that start instantly and consume zero electricity while in standby mode.

Key features of these newly developed technologies:

• High-speed data retrieval

In order for CAM to be both nonvolatile and maintain a high speed, two spintronics devices, spinning in opposite directions to one another, were connected within the same cell. In terms of constructing the circuit, writing is done once by connecting two devices in a series using recently developed three pin particles that separate the current path into writing and reading.

This new process enables cells to become more compact since the number of writing switches per element is reduced by one. Moreover, the new CAM achieve the same level of high-speed data retrieval as current CMOS based CAM that feature 5ns and low power consumption of 9.4mW.

• Approximately half the circuit area in comparison to existing technologies
In addition to the vertical domain wall element can connect in series by separating the route of current into reading and writing, the newly developed CAM circuit technologies can reduce the number of transistors from eight to three in every two cells by sharing transistors. This results in a 50% CAM area reduction.

NEC developed nonvolatile particles aiming for both greater convenience and energy conservation. Additionally, NEC and Tohoku University developed a simulation technology for a circuit diagram including spintronics particles in parallel with designing technologies for massively large integrated circuits for developments involving the most advanced spintronics logic integrated circuits.

NEC and Tohoku University will announce their latest results on June 17 at VLSI Circuit Symposium 2011 (June 13-17, Kyoto).

Provided by NEC