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Showing posts with label Boiling point. Show all posts
Showing posts with label Boiling point. Show all posts

Thursday, August 19, 2010

Roller Coaster Superconductivity Discovered


Superconductors are more than 150 times more efficient at carrying electricity than copper wires. However, to attain the superconducting state, these materials have to be cooled below an extremely low, so-called transition temperature, at which point normal electrical resistance disappears. Developing superconductors with higher transition temperatures is one of physics' greatest quests.
This graphic shows the crystal structure of three-
layered bismuth oxide. (Credit: Xiao-Jia Chen)

Now, researchers at the Carnegie Institution's Geophysical Laboratory, with colleagues, have unexpectedly found that the transition temperature can be induced under two different intense pressures in a three-layered bismuth oxide crystal referred to as "Bi2223." The higher pressure produces the higher transition temperature. They believe this unusual two-step phenomena comes from competition of electronic behavior in different kinds of copper-oxygen layers in the crystal.

The work is published in the August 19, 2010, issue of Nature.

Until now, copper-laden materials called cuprates have been the only superconductors whose transition temperatures are higher than the liquid nitrogen boiling point at -321°F (77 K). Whether researchers can make transition temperatures higher in such materials remains a challenge.

"Bi2223 is like a layered cake," explained lead author Xiao-Jia Chen at Carnegie. "On the top and bottom there are insulating bismuth-oxide layers. On the inside of those, come layers of strontium oxide. Next, are layers of copper oxide, then calcium, and finally the middle is another copper-oxide layer. Interestingly, the outermost and inner layers of copper oxide have different physical properties resulting in an imbalance of electric charge between the layers."

One way scientists have found to increase the transition temperature of superconducting materials is to "dope" them by adding charged particles.

Under normal pressure, the optimally doped Bi2223's transition temperature is -265°F (108K). The scientists subjected doped crystals of the material to a range of pressures up to 359,000 times the atmospheric pressure at sea level (36.4 Giga Pascal), the highest pressure yet for magnetic measurements in cuprate superconductors. The first higher transition temperature happened at 100,666 atmospheres (10.2 GPa).

"After that, increasing pressures ended up with lower transition temperatures," remarked Chen. "Then to our complete surprise at about 237,000 atmospheres (24 GPa) the superconducting state reappeared. Under even more pressure, 359,000 atmospheres, the transition temperature rose to -215°F (136K). That was the highest pressure our measuring system could detect."

Other research has shown that some multilayered superconducting materials like this one exhibit different electronic and vibrational behaviors in different layers. The researchers think that 237,000 atmospheres might be a critical point where pressure suppresses one behavior and enhances superconductivity.

"The finding gives new perspectives on making higher transition temperature in multilayer cuprate superconductors. The research may offer a promising way of designing and engineering superconductors with much higher transition temperatures at ambient conditions," concluded coauthor Viktor Struzhkin also of Carnegie.

The research was supported by the U. S. Department of Energy, Carnegie Canada, and the National Natural Science Foundation of China.

This work was conducted in collaboration with researchers at the South China University of Technology and Max Plank Institute for Solid State Research in Germany.

Sunday, July 25, 2010

Nanowick at Heart of New System to Cool 'Power Electronics'


Researchers have shown that an advanced cooling technology being developed for high-power electronics in military and automotive systems is capable of handling roughly 10 times the heat generated by conventional computer chips.
Image
This is a test facility for nanowicks. (Credit: Purdue 
University School of Mechanical Engineering)

The miniature, lightweight device uses tiny copper spheres and carbon nanotubes to passively wick a coolant toward hot electronics, said Suresh V. Garimella, the R. Eugene and Susie E. Goodson Distinguished Professor of Mechanical Engineering at Purdue University.

This wicking technology represents the heart of a new ultrathin "thermal ground plane," a flat, hollow plate containing water.

Similar "heat pipes" have been in use for more than two decades and are found in laptop computers. However, they are limited to cooling about 50 watts per square centimeter, which is good enough for standard computer chips but not for "power electronics" in military weapons systems and hybrid and electric vehicles, Garimella said.

The research team from Purdue, Thermacore Inc. and Georgia Tech Research Institute is led by Raytheon Co., creating the compact cooling technology in work funded by the Defense Advanced Research Projects Agency, or DARPA.

The team is working to create heat pipes about one-fifth the thickness of commercial heat pipes and covering a larger area than the conventional devices, allowing them to provide far greater heat dissipation.

New findings indicate the wicking system that makes the technology possible absorbs more than 550 watts per square centimeter, or about 10 times the heat generated by conventional chips. This is more than enough cooling capacity for the power-electronics applications, Garimella said.

The findings are detailed in a research paper appearing online this month in the International Journal of Heat and Mass Transfer and will be published in the journal's September issue. The paper was written by mechanical engineering doctoral student Justin Weibel, Garimella and Mark North, an engineer with Thermacore, a producer of commercial heat pipes located in Lancaster, Pa.

"We know the wicking part of the system is working well, so we now need to make sure the rest of the system works," North said.

The new type of cooling system can be used to prevent overheating of devices called insulated gate bipolar transistors, high-power switching transistors used in hybrid and electric vehicles. The chips are required to drive electric motors, switching large amounts of power from the battery pack to electrical coils needed to accelerate a vehicle from zero to 60 mph in 10 seconds or less.

Potential military applications include advanced systems such as radar, lasers and electronics in aircraft and vehicles. The chips used in the automotive and military applications generate 300 watts per square centimeter or more.

Researchers are studying the cooling system using a novel test facility developed by Weibel that mimics conditions inside a real heat pipe.

"The wick needs to be a good transporter of liquid but also a very good conductor of heat," Weibel said. "So the research focuses largely on determining how the thickness of the wick and size of copper particles affect the conduction of heat."

Computational models for the project were created by Garimella in collaboration with Jayathi Y. Murthy, a Purdue professor of mechanical engineering, and doctoral student Ram Ranjan. The carbon nanotubes were produced and studied at the university's Birck Nanotechnology Center in work led by mechanical engineering professor Timothy Fisher.

"We have validated the models against experiments, and we are conducting further experiments to more fully explore the results of simulations," Garimella said.

Inside the cooling system, water circulates as it is heated, boils and turns into a vapor in a component called the evaporator. The water then turns back to a liquid in another part of the heat pipe called the condenser.

The wick eliminates the need for a pump because it draws away fluid from the condenser side and transports it to the evaporator side of the flat device, Garimella said.

Allowing a liquid to boil dramatically increases how much heat can be removed compared to simply heating a liquid to temperatures below its boiling point. Understanding precisely how fluid boils in tiny pores and channels is helping the engineers improve such cooling systems.

The wicking part of the heat pipe is created by sintering, or fusing together tiny copper spheres with heat. Liquid is drawn sponge-like through spaces, or pores, between the copper particles by a phenomenon called capillary wicking. The smaller the pores, the greater the drawing power of the material, Garimella said.

Such sintered materials are used in commercial heat pipes, but the researchers are improving them by creating smaller pores and also by adding the carbon nanotubes.

"For high drawing power, you need small pores," Garimella said. "The problem is that if you make the pores very fine and densely spaced, the liquid faces a lot of frictional resistance and doesn't want to flow. So the permeability of the wick is also important."

The researchers are creating smaller pores by "nanostructuring" the material with carbon nanotubes, which have a diameter of about 50 nanometers, or billionths of a meter. However, carbon nanotubes are naturally hydrophobic, hindering their wicking ability, so they were coated with copper using a device called an electron beam evaporator.

"We have made great progress in understanding and designing the wick structures for this application and measuring their performance," said Garimella. He said that once ongoing efforts at packaging the new wicks into heat pipe systems that serve as the thermal ground plane are complete, devices based on the research could be in commercial use within a few years.